Job Title : IC Packaging Design Engineer
Job Location : Chandler, AZ/ Hillsboro, OR (Onsite)
Duration : 12+ Months
Job Description:
As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.
What You'll Do
What You Bring
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